
"Apple's next Vision Pro will come with the R2 chip, a self-developed one that will be built on TSMC's 2nm process. As the name implies, this is the successor to the R1 chip, which is present in the original Vision Pro. The R1 is a dedicated co-processor that handles input from the headset's cameras, sensors, and mics, including for tracking eye movements, hand gestures, and head position."
"It stands to reason that the R2 will be used for the same purposes, only it should perform better and possibly also need less energy due to the smaller process on which it will be manufactured. The iPhone 18 is said to enjoy Apple's upcoming self-developed C2 modem chip, paired with the A20 chip that will be made on TSMC's 2nm process just like the next Vision Pro's R2."
Apple plans an R2 chip for the next Vision Pro, a self-developed co-processor set to be manufactured on TSMC's 2nm process. The R2 will succeed the R1 and likely continue handling camera, sensor, and microphone inputs, including eye, hand, and head tracking. The 2nm node should enable higher performance and lower power consumption compared with the R1's implementation. Apple is also said to pair an upcoming self-developed C2 modem with an A20 application chip built on TSMC's 2nm process for the iPhone 18. An updated Vision Pro may arrive this year, while a true successor could appear in 2027.
Read at GSMArena.com
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