"Ming-Chi Kuo reported that OpenAI's smartphone is now expected to enter mass production in the first half of 2027, accelerated due to the growing AI phone market and a potential year-end IPO."
"The device is expected to use a customized Dimensity 9600 chipset, built on TSMC's N2P process, with imaging as a major focus featuring an enhanced HDR pipeline."
"The OpenAI phone will include a dual-NPU architecture for AI workloads, LPDDR6 RAM, and UFS 5.0 storage, with security features like pKVM and inline hashing."
"If development remains on track, total shipments of the OpenAI smartphone could hit 30 million units in 2027 and 2028."
OpenAI's AI-agent smartphone is anticipated to begin mass production in the first half of 2027, accelerated from a previous 2028 timeline. This shift is attributed to the expanding AI phone market and a potential IPO. Key specifications include a customized Dimensity 9600 chipset from MediaTek, enhanced imaging capabilities with an improved HDR pipeline, dual-NPU architecture for AI tasks, LPDDR6 RAM, and UFS 5.0 storage. If development proceeds as planned, shipments could reach 30 million units in 2027 and 2028.
Read at GSMArena.com
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